ABB EPIS Today, the company delivers Total Efficiency™ power conversion solutions carrying on the tradition of patented innovation with energy-efficient AC-DC power supplies and DC-DC board mounted power modules telecom energy systems, and custom power products backed by local field expertise in 25+ locations worldwide. End-to-End Embedded Power, DC Power Systems, UPS, Power Switching.

Critical Power Distribution, UPS, Transfer Switches and Turnkey Datacenter Containers

• Products for AC/DC OEM Embedded power for datacom, telecom, medical and industrial applications.
• Products for DC-DC OEM conversion for board mounted power applications in communications, computing, storage, industrial, medical and military markets
• Full custom capabilities in both AC-DC and DC-DC product lines
  • AC-DC supplies up to 6kW
  • Up to 80+ Platinum Efficiency
  • Rack mounted solutions
  • Isolated and non-isolated DC-DC converters
  • Design Automation tools
    

CTS Corporation is a leading designer and manufacturer of sensors, actuators and electronic components to OEMs in the aerospace, communications, defense, industrial, information technology, medical, and transportation markets.

• Quartz Crystals, Clock Oscillators: nWave, VCXOs, VCSOs, TCXOs, OCXOs
• RF and Timing Modules: VCOs (Voltage Controlled Oscillators), VCO, PLL Synthesizers, Frequency Translator/Jitter Attenuators, Front End Modules, Clock Generators/Timing Modules
• Ceramic Components: Monoblock Filters, Duplexers
• Resistor/Electro Components: Clear one BGA Terminators, Resistor N3etworks and Arrays, Trimmers, DIP Switches, Potentiometers
• Heat Sinks/Thermal Solutions: Extruded/Stamped and Precision Forged, Military and Commercial

Nanya Technology Corporation (NTC) aims to be the best DRAM memory solution provider. NTC is offering broadest portfolio of memory solutions– in products ranging from 512Mb to 8Gb memory products for the following market applications:

• Home & Entertainment: Nanya offers reliable and stable DRAM solutions to cover consumer DRAM(DDR ~ DDR4) required for home applications. For density, choices range from 512Mb to 8Gb to best fit a variety of applications including DTV, STB, DVD, Networking, Game console and IoT applications.
• Mobile & Portable: Nanya Technology carries a comprehensive mobile product line that covers technologies from LPDDR1 to LPDDR4X, with densities ranging up to 16Gb. Nanya supports multiple package options for low power DRAM that include PoP or BGA or MCP packages depending on customer requirements.
• Automotive: Nanya Technology´s automotive grade products are certificated by AEC- Q100 and TS16949. Product densities range from 512Mb ~ 8Gb with temperature coverage from -40℃ to 105℃. Nanya Automotive & Industrial DRAM devices are also offered as low power DRAM and wide temperature MCP.
• Office & Enterprise: Nanya has become a valued solution in this market with a strong DRAM portfolio that serves the office and enterprise needs such as networking, storage and other office peripherals. Nanya´s products include standard DRAM and Low power DRAM (LPDRAM) with a density selection ranging from 512Mb to 8Gb.
• Custom: Foundry Services on custom Non-JEDEC DRAM applications

Sharp Put the durability, dependability, and dazzle of Sharp LCDs to work in your signage products. Our e-Signage Modules make a big impact with the true-to-life detail of Full-HD. Sharp’s UV2A process enhances the picture with wide viewing angles and high contrast. The displays are flexible for use in either portrait or landscape mode.

• Industrial Strength LCDs from 3.5” to 23.1” featuring LED backlighting to enable lower power consumption, long backlight life, slim profiles and high resistance.
• Ultra-low Power Memory LCDs from 0.96” to 4.4”: Consumer Performance enhanced by a lightweight, two-glass design plus an integrated driver in the panel.
• e-Signage Modules from 70” to 90”: True-to-life detail of Full-HD.
• Sharp offers value added integration including touch sensors, bonding, brightness enhancements to adapt to a display panel for any application.
• Integrated circuits with advanced CMOS and CCD solutions for imaging applications.

Dawar is a Value Add Partner bringing value added integrated touch screen solutions to our market.

Learn more about Dawar

Toshiba offers a wide range of semiconductors and storage products, making us a single-source option for a number of solutions and customers. We work closely with OEMs, ODMs, CMs, VARs and fabless chip companies to define the right product mix and new technology innovations. Through proven commitment and lasting relationships, Toshiba semiconductors and storage products make possible todays' latest smartphones, tablets, ebooks, digital cameras, head mounted devices, medical devices, automotive applications, networking, enterprise applications, and PC and notebook storage.

Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Viking Technology specializes in Non-Volatile DIMMs (NVDIMM), Solid State Drives (SSD), and DRAM solutions. With a breadth of products that spans embedded flash solutions:

• Embedded FLASH Solutions: eUSB, Secure Digital (SD), mSATA, SlimSATA, and M.2 SSD
• Enterprise Solutions: NVDIMM Persistent memory, 2.5in & 1.8in SATA/PCIe/NVMe/SAS SSDs.
• DRAM Solutions: DDR4 to legacy support of DDR1 in every form factor both standard, ultra-small, unique, and custom designs.

Viking Technology’s engineering services, design, and expertise also support strategic partner engagements to enable customized solutions not found anywhere else. These solutions span technology engagements in ultra-extreme temperatures (-40oC to +200oC), ruggedization, shock & vibe, high-density die stacking, conformal coating, heat dissipation, miniaturization, future storage class memory, and specialize form factor designs.