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SAN JOSE, Calif. – July 18, 2017 – Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announced that its lineup of Bluetooth® Low Energy products now offer support for the Bluetooth Mesh standard. Ratified and launched today by the Bluetooth Special Interest Group (SIG), the combination of Bluetooth Mesh and TAEC’s application software enable Toshiba Bluetooth Low Energy products to simultaneously increase communication range, reliability and obstacle penetration capability while also increasing battery life.
Toronto, Ontario – June 27, 2017 – Electro Source Inc. Signs Representative Agreement with VIKING Technology, effective July 1, 2017.
Viking Technology is a global technology leader in the fields of RF, Optical, Microelectronics and Memory technologies. With over 25+ years of experience in Engineering, Design, Manufacturing and Test, Viking Technology has led some of the most leading-edge OEM solutions for the embedded/industrial, medical, telecommunications, and military/aerospace markets.
In the field of Memory engineering, Viking Technology specializes in Non-Volatile DIMMs (NVDIMM), Solid State Drives (SSD), and DRAM solutions. With a breadth of products that spans embedded flash solutions such as eUSB, Secure Digital (SD), mSATA, SlimSATA, and M.2 SSD to enterprise solutions such as NVDIMM Persistent memory along with 2.5in & 1.8in SATA/PCIe/NVMe/SAS SSDs. Viking Technology also offers one of the most comprehensive lines of DRAM solutions spanning from DDR4 to legacy support of DDR1 in every form factor both standard, ultra-small, unique, and custom designs.
Viking Technology’s engineering services, design, and expertise also support strategic partner engagements to enable customized solutions not found anywhere else. These solutions span technology engagements in ultra-extreme temperatures (-40oC to +200oC), ruggedization, shock & vibe, high-density die stacking, conformal coating, heat dissipation, miniaturization, future storage class memory, and specialize form factor designs.
GE Expands Board-Level Power Conversion Capabilities with
Next-Generation DLynx* II Digital, Non-Isolated DC-DC Voltage Converters
• Latest Additions to DLynx* Product Line Utilize Digital Features to Provide More Accurate Voltage Control and Measurement Capabilities Compared to Previous Models
• High Power Density Frees up Valuable Board Space
ATLANTA — May 17, 2017 — In 2011, GE (NYSE: GE) helped pioneer the digital point-of-load (PoL) power module with the launch of its DLynx* solutions. Today, the company is helping to progress the embedded power industry further with the introduction of its DLynx II* family of PoLs. The second-generation digital, non-isolated voltage converters offer improved performance, additional digital features, greater density and a broader range of applications— enabled by higher current PoLs — compared to previous products.
IRVINE, Calif., May 2, 2017 /PRNewswire/ — Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has expanded its extensive portfolio of photorelays with the addition of two 4-pin SO6 package products. The new TLP172AM and TLP172GM operate at temperatures up to 110°C, feature an isolation voltage of up to 3750Vrms and have a 3mA (max) trigger current. This makes them suitable for use as function switches in measuring equipment, sensor switches in security systems, power monitoring function in battery management systems, IoT equipment and more.
PLANO, TX, March 30, 2017– Siemens AG, With the recent closing of its acquisition of electronic design automation (EDA) software leader, Mentor Graphics Corporation (Mentor), Siemens sets out to underscore the significant customer value it envisions for both Electronic Systems and Integrated Circuit (IC) design tools. Mentor is now part of Siemens’ product lifecycle management (PLM) software business….