Meet our Team at APEC 2026
AI-Enabled Power Electronics Design,
Simulation & Thermal Validation
Date: March 22–26, 2026
Location: Henry B. Gonzalez Convention Center, San Antonio, TX
Booth 2319
Prove Performance. Accelerate Time-To Market.
Explore Siemens’ market leading solutions for the design, simulation, and test of power electronics.
Learn how coupled thermal simulation & test workflows featuring the Micred test hardware and software enable engineers to optimize power semiconductor thermal performance ensuring cost effective, high quality, and reliable designs.
Advanced thermal performance solutions coupling simulation with non-destructive testing provide unmatched accuracy for thermal design and validation.
Now PSIM & Flux are with Siemens – learn how they are being integrated into AI-enabled solutions reducing your time to market.
Giveaway Registration
Services
Thermal Simulation & Testing
Coupled simulation and hardware validation for semiconductor optimization.
Thermal Performance
Advanced validation ensuring robust, long-life designs.
Noise and Vibration Analysis
Precision NVH analysis to ensure operational stability and performance.
Automated Test & Validation Solutions
Streamlined automated workflows for repeatable, high-accuracy testing.
IS09.6 – Reduced-Order Magnetics Modeling: Accelerating Power Electronics Design with FEA Insights
Date: Wednesday, March 25, 2026
Time: 11:05 AM – 11:30 AM CT
Location: Room 210
Presenter: Nikos Dimitrakopoulos – Altair Engineering
This talk presents a methodology to bridge the gap between analytical magnetics models and high-fidelity finite element analysis (FEA) for power electronics applications. The session demonstrates how reduced-order models created using FEA insights can integrate into system-level simulations, improving simulation fidelity while accelerating design workflows.
Find This SessionIS16.4 – Optimized Component Selection for Multi-Stage Power Conversion Systems
Date: Wednesday, March 25, 2026
Time: 2:45 PM – 3:10 PM CT
Location: Room 207
Presenter: Juan A. Rosales – Siemens
This session explores a workflow for optimizing transistor selection in multi-stage power conversion systems using electrical simulation and vendor component data. Engineers will see how GaN, SiC and Si technologies can be evaluated across different configurations to optimize thermal performance, cost and system footprint.
Find This SessionIS15.7 – Lessons Learned Converting High-Fidelity Switching Models into AI-Based Reduced-Order Models
Date: Wednesday, March 25, 2026
Time: 4:30 PM – 4:55 PM CT
Location: Room 210
Presenter: Rafael Sánchez Garciarivas – Siemens
Co-Author: Albert W. Dunford – Siemens
High-fidelity switching models of resonant power converters often create computational bottlenecks for system-level analysis. This presentation discusses practical lessons learned when developing AI-based reduced-order models for LLC resonant converters, enabling engineers to achieve high accuracy simulations with dramatically reduced computation time.
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