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SUMMARY:WORKSHOP: 3DIC Modeling & Thermal Workshop
DESCRIPTION:An in-person\, hands-on workshop for engineers working on advanced packaging\, chiplets\, and 2.5D/3D ICs.\nLearn integrated approaches to electrothermal analysis and system-level cooling — from chip to data center — with live demos and take-home workflows. \nWe invite you to an exclusive experience focused on holistic thermal solutions—from chip-level modeling to full-scale data center performance. This event will explore cutting-edge techniques for optimizing thermal performance across every level of design. \nSpace is limited—reserve your spot today.\nWe look forward to welcoming you to this insightful discussion on the future of thermal management.
URL:https://electrosource.com/event/workshop-3dic-modeling-thermal-workshop/
LOCATION:University of Texas at Austin\, 204 E Dean Keeton St\, Austin\, TX\, 78712\, United States
CATEGORIES:Workshop
ATTACH;FMTTYPE=image/jpeg:https://electrosource.com/wp-content/uploads/2025/10/1758831390295.jpg
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