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WORKSHOP: 3DIC Modeling & Thermal Workshop
October 22, 2025 @ 11:00 am - 5:00 pm
An in-person, hands-on workshop for engineers working on advanced packaging, chiplets, and 2.5D/3D ICs.
Learn integrated approaches to electrothermal analysis and system-level cooling — from chip to data center — with live demos and take-home workflows.
We invite you to an exclusive experience focused on holistic thermal solutions—from chip-level modeling to full-scale data center performance. This event will explore cutting-edge techniques for optimizing thermal performance across every level of design.
Space is limited—reserve your spot today.
We look forward to welcoming you to this insightful discussion on the future of thermal management.