Arm DevSummit 2021
VirtualWHERE HARDWARE AND SOFTWARE JOIN FORCES Engineers, developers, and tech enthusiasts: Arm DevSummit 2021 is coming to your screens October 19-21. This three-day virtual conference…
WHERE HARDWARE AND SOFTWARE JOIN FORCES Engineers, developers, and tech enthusiasts: Arm DevSummit 2021 is coming to your screens October 19-21. This three-day virtual conference…
How Smart Is Your Testing? UI testing alone may not reach coverage or quality goals. By expanding to the API layer, API test automation can…
MOSFETs used in high-performance power supply circuits are frequently squeezed side-by-side with heat-generating electronics, such as CPUs, photovoltaic cells and motors. This compromises a printed circuit board’s (PCB) ability to act as a heat sink for both the system and MOSFET. Taking into account the power supply’s density requirements, designers must find innovative ways to remove heat from MOSFETs without affecting power integrity. Toshiba’s “Double Side Cooling” SOP-package (DSOP-Advance) features an additional vector for heat dissipation that keeps MOSFETs running cool while increasing performance and reliability.