09/14/2023
Gotion High-tech selects Siemens Xcelerator for digital transformation of battery engineering and manufacturing
09/14/2023
Together, we are building the future of computing, on Arm
09/14/2023
Toshiba Expands Line-up of Thermoflagger™, a Simple Solution that Detects Temperature Rises in Electronic Equipment
08/28/2023
Driving the Custom Silicon Revolution with Arm Neoverse Compute Subsystems
08/16/2023
Synopsys Posts Financial Results for Third Quarter Fiscal Year 2023
08/08/2023
Synopsys Partners with NowSecure and Secure Code Warrior to Expand Industry-Leading Application Security Testing Solutions Portfolio
08/02/2023
TTM Technologies, Inc. Reports Fiscal Second Quarter 2023 Results
07/20/2023
SK hynix adopts Siemens’ Polarion to help gain Korea’s first ASPICE certification
07/03/2023
AcBel Completes Acquisition of the Power Conversion Division of ABB
06/22/2023
Siemens Xcelerator speeds development of maglev system to beat global traffic
06/13/2023
Synopsys Recognized as a Leader in Software Composition Analysis by Independent Research Firm
06/07/2023
Arm SystemReady surpasses 100 certifications, driving standardization where it matters
06/03/2023
ABB’s DLynx III DC/DC converters provide flexible, power-dense solutions for data-hungry applications
03/29/2023
Synopsys.ai Unveiled as Industry’s First Full-Stack, AI-Driven EDA Suite for Chipmakers
03/23/2023
Siemens named a Leader in Product Lifecycle Management for Discrete Manufacturers Q1 2023 report
02/07/2023
Toshiba Releases Intelligent Power Devices That Help Reduce Mounting Areas
01/31/2023
Toshiba Releases Automotive 40V N-channel Power MOSFETs with New High Heat Dissipation Package that Supports Larger Currents for Automotive Equipment
01/24/2023
Molex Elevates Electrical Safety in Harsh Environments with Launch of First Portable, IP69K-Rated Super-Safeway Ground Fault Circuit Interrupter (GFCI)
01/20/2023
Toshiba Releases Intelligent Power Devices That Help Reduce Mounting Areas
01/19/2023
Toshiba Releases Automotive 40V N-channel Power MOSFETs with New High Heat Dissipation Package that Supports Larger Currents for Automotive Equipment
12/18/2022
Toshiba to Expand Power Semiconductor Production Capacity with New Production Facility