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An in-person, hands-on workshop for engineers working on advanced packaging, chiplets, and 2.5D/3D ICs. Learn integrated approaches to electrothermal analysis and system-level cooling — from chip to data center — […]
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An in-person, hands-on workshop for engineers working on advanced packaging, chiplets, and 2.5D/3D ICs. Learn integrated approaches to electrothermal analysis and system-level cooling — from chip to data center — […] |
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