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Innovative MOSFET Heat Dissipation Method for High-Density Power Circuits
VirtualMOSFETs used in high-performance power supply circuits are frequently squeezed side-by-side with heat-generating electronics, such as CPUs, photovoltaic cells and motors. This compromises a printed circuit board’s (PCB) ability to act as a heat sink for both the system and MOSFET. Taking into account the power supply’s density requirements, designers must find innovative ways to remove heat from MOSFETs without affecting power integrity. Toshiba’s “Double Side Cooling” SOP-package (DSOP-Advance) features an additional vector for heat dissipation that keeps MOSFETs running cool while increasing performance and reliability.
